The Pulse: Drilling Down on Documentation
Connect the Dots: Designing for Reality: Prioritizing ManufacturabilityBreaking News: Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing...
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
At IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB...
Cadence Reports First Quarter 2024 Financial Results
Quarter-end backlog was $6.0 billion and current remaining performance obligations ("cRPO"), contract revenue expected to be recognized as revenue in...
What’s Next Becomes Now at IPC APEX EXPO 2024
From revolutionary advancements in artificial intelligence, augmented reality and the latest innovations in capital equipment on the show floor to a heightened learner experience through the 16th Electronic Circuits World...
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Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
April 25, 2024 | Real Time with...IPC APEX EXPO
Guest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
April 24, 2024 | Vern Solberg, Designer's Notebook
The printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
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The Shaughnessy Report: Design Takes Center Stage at IPC APEX EXPO
April 9, 2024 | Andy Shaughnessy, The Shaughnessy Report
When leveling up your design skill set, opportunities abound at this year's IPC APEX EXPO conference and exhibition being held in Anaheim, California. There’s more design curriculum at the conference this year than ever before. I...
Elementary, Mr. Watson: Ensuring Design Integrity
March 28, 2024 | John Watson, Elementary, Mr. Watson
Back in February, many of us watched the "Big Game." It reminded me of the saying, “It's not how you start that is important, but rather how you finish." It is perfectly okay when you are talking about sports, you get off to a bad...
Beyond Design: The Art of Presenting PCB Design Courses
March 21, 2024 | Barry Olney, Beyond Design
In the early days of my career, I was a typical backroom geek more comfortable with technology than engaging in conversation. My obsession lay in my work, fueled by the exhilaration of mastering new technologies. The notion of...
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