-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ESI's Most Extensible Laser Micromachining Platform Delivers Efficient Manufacturing for Consumer Electronics
June 25, 2015 | ESIEstimated reading time: 2 minutes
Electro Scientific Industries, Inc., an innovator of laser-based manufacturing solutions for the micromachining industry, today introduced Jade™, the new low-cost, high-volume-production laser micromachining platform adaptable to a range of configurations for different applications including cutting, marking, drilling and engraving.
The new platform addresses challenges faced by manufacturers in the fast-changing consumer electronics segment where they cope with new materials, new technologies and evolving consumer expectations. Meanwhile, there is relentless pressure to reduce costs, meet quality requirements and achieve high-volume high-yield production. The Jade™ platform is the first laser micromachining platform capable of meeting all these diverse requirements, offering unprecedented levels of versatility and cost-efficient operation.
"Production requirements in consumer electronics are constantly changing with new materials and features that require a range of laser micromachining processes that can be delivered quickly and at an attractive cost of ownership," said Edward C. Grady, President and CEO of ESI. "We are directly addressing this challenge with the Jade™ platform. Designed by ESI's cooperative China-USA engineering operation, this low-cost platform is adaptable, reliable, and locally built and serviced by our support teams on the ground in China."
The Jade™ platform is designed to provide contract and consumer electronics manufacturers with a smarter manufacturing option through the use of extendable and configurable stages, lasers, and automation. The base platform can be configured with multiple laser and optics options as well as a range of add-on options including pre- and post-inspection, metrology and advanced alignment automation. All configurations use a common user interface to reduce training time.
This flexibility means that a Jade™ platform can address multiple marking, cutting, and drilling applications in a responsive and cost-effective manner, improving the useful lifespan of the tool and significantly lowering overall cost of ownership for our customers. The Jade™ platform continues ESI's commitment to reliability, responsive local support in China, and to meeting expectations for precision and high-volume yields.
Availability
The Jade™ Series of platforms are available now in China, Vietnam, India, Korea and Taiwan. For more information go to www.esi.com.
About ESI
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Suggested Items
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.
The Many Complexities of PFAS
03/26/2024 | Marcy LaRont, PCB007 MagazineIn its simplest definition, PFAS is a group of chemicals used to make fluoropolymer coatings and products that resist heat, oil, stains, grease, and water. Fluoropolymer coatings can be in a variety of products. Though this definition is not inaccurate, it can be misleading. Depending on who you ask, there are upward of 10,000 PFAS chemistries that can meet various definitions.