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Benchmark Electronics, Inc., a leading integrated contract manufacturing provider, today announced that its Nashua, New Hampshire facility has been awarded the ISO 13485:2003 certification for medical manufacturing. This standard represents a comprehensive quality management system for the manufacture of medical devices throughout the full product lifecycle.
In addition to the new medical certification, the 150,000 square foot New Hampshire facility holds certifications for AS9100C, ISO 9001:2008, ISO 14001:2004, and ANSI/ESD S20.20 and is a registered ITAR facility. The facility specializes in fiber optic, robotic, and advanced system manufacturing and testing for products and end markets with extreme reliability requirements.
"Achieving this certification in our Nashua facility reflects our strategy to expand our high quality medical manufacturing expertise in support of our regional and global customers," said Gayla J. Delly, President and CEO of Benchmark. "Growth in medical device manufacturing is central to our long-term strategy. We will continue to leverage our strong medical heritage and outstanding quality systems to purposefully align our capabilities in support of our global customers."
About Benchmark Electronics, Inc.
Benchmark Electronics, Inc. provides integrated manufacturing, design and engineering services to original equipment manufacturers of industrial control equipment (which includes equipment for the aerospace and defense industries), telecommunication equipment, computers and related products for business enterprises, medical devices, testing and instrumentation products. Benchmark's global operations include facilities in seven countries, and its common shares trade on the New York Stock Exchange under the symbol BHE.
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.