Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IPC APEX EXPO: Some Thoughts About Growth

05/16/2024 | Dan Feinberg, I-Connect007
After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.

The Shaughnessy Report: Unlock Your High-speed Material Constraints

05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.

Breaking High-speed Material Constraints: Design007 Magazine — May 2024

05/14/2024 | I-Connect007 Editorial Team
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.

Indium Experts to Present at Electronics in Harsh Environments SMTA Conference

05/13/2024 | Indium Corporation
ndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.

Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation

05/09/2024 | ANSYS
Ansys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in